Single-crystal micromachining using multiple fusion-bonded layers

A Brown; G O'Neill; S Blackstone

doi:10.1117/12.396460

Single-crystal micromachining using multiple fusion-bonded layers

A Brown
, G O'Neill
, S Blackstone

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Citations (Scopus)

Abstract

Multi-layer structures have been fabricated using Fusion bonding. The paper shows void free layers of between 2 and 100 microns that have been bonded to form multi-layer structures. Silicon layers have been bonded both with and without interfacial oxide layers

Original language	English
Title of host publication	Unknown Host Publication
Pages	406-415
Number of pages	10
DOIs	https://doi.org/10.1117/12.396460
Publication status	Published (in print/issue) - 1 Aug 2003
Event	Micromachining and Microfabrication Process Technology VI - Santa Clara Duration: 1 Aug 2003 → …

Conference

Conference	Micromachining and Microfabrication Process Technology VI
Period	1/08/03 → …

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10.1117/12.396460

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@inproceedings{e482f3002fff47578d001a08b98cd244,

title = "Single-crystal micromachining using multiple fusion-bonded layers",

abstract = "Multi-layer structures have been fabricated using Fusion bonding. The paper shows void free layers of between 2 and 100 microns that have been bonded to form multi-layer structures. Silicon layers have been bonded both with and without interfacial oxide layers",

author = "A Brown and G O'Neill and S Blackstone",

year = "2003",

month = aug,

day = "1",

doi = "10.1117/12.396460",

language = "English",

pages = "406--415",

booktitle = "Unknown Host Publication",

note = "Micromachining and Microfabrication Process Technology VI ; Conference date: 01-08-2003",

}

TY - GEN

T1 - Single-crystal micromachining using multiple fusion-bonded layers

AU - Brown, A

AU - O'Neill, G

AU - Blackstone, S

PY - 2003/8/1

Y1 - 2003/8/1

N2 - Multi-layer structures have been fabricated using Fusion bonding. The paper shows void free layers of between 2 and 100 microns that have been bonded to form multi-layer structures. Silicon layers have been bonded both with and without interfacial oxide layers

AB - Multi-layer structures have been fabricated using Fusion bonding. The paper shows void free layers of between 2 and 100 microns that have been bonded to form multi-layer structures. Silicon layers have been bonded both with and without interfacial oxide layers

U2 - 10.1117/12.396460

DO - 10.1117/12.396460

M3 - Conference contribution

SP - 406

EP - 415

BT - Unknown Host Publication

T2 - Micromachining and Microfabrication Process Technology VI

Y2 - 1 August 2003

ER -

Single-crystal micromachining using multiple fusion-bonded layers

Abstract

Conference

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