Simultaneous enhancement of electrical conductivity and interlaminar fracture toughness of carbon fiber/epoxy composites using plasma treated conductive thermoplastic film interleaves

Wei Li, Dong Xiang, Lei Wang, Eileen Harkin-Jones, Chunxia Zhao, Bin Wang, Yuntao Li

Research output: Contribution to journalArticle

Abstract

Multiwalled carbon nanotube (MWCNT)-doped polyamide 12 (PA12) films with various nanofiller loadings
were prepared via a solution casting method to simultaneously improve the electrical conductivity and
fracture toughness of carbon fiber/epoxy (CF/EP) composites. The films were interleaved between CF/EP
prepreg layers and melted to bond with the matrix during the curing process. To improve the interfacial
compatibility and adhesion between the conductive thermoplastic films (CTFs) and the epoxy matrix, the
CTFs were perforated and then subjected to a low temperature oxygen plasma treatment before
interleaving. Fourier transform infrared (FTIR) spectra results confirm that oxygen-containing functional
groups were introduced on the surface of the CTFs, and experimental results demonstrate that the
electrical conductivity of the laminates was significantly improved. There was a 2-fold increase in the
transverse direction electrical conductivity of the laminate with 0.7 wt% MWCNT loading and a 21-fold
increase in the through-thickness direction. Double cantilever beam (DCB) tests demonstrated that the
Mode-I fracture toughness (GIC) and resistance (GIR) of the same laminates significantly increased by 59%
and 113%, respectively. Enhancements of both interlaminar fracture toughness and electrical conductivity
are mainly attributed to the strong interfacial adhesion achieved after plasma treatment and to the
bridging effect of the carbon nanotubes.
LanguageEnglish
Pages26910-26921
Number of pages12
JournalRSC Advances
Volume8
DOIs
Publication statusPublished - 30 Jul 2018

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Thermoplastics
Carbon fibers
Fracture toughness
Laminates
Plasmas
Multiwalled carbon nanotubes (MWCN)
Composite materials
Adhesion
Oxygen
Carbon Nanotubes
Cantilever beams
Polyamides
Toughness
Curing
Carbon nanotubes
Fourier transforms
Casting
Infrared radiation
Electric Conductivity
carbon fiber

Cite this

@article{e590264591dd482ca80786d7f5a28f64,
title = "Simultaneous enhancement of electrical conductivity and interlaminar fracture toughness of carbon fiber/epoxy composites using plasma treated conductive thermoplastic film interleaves",
abstract = "Multiwalled carbon nanotube (MWCNT)-doped polyamide 12 (PA12) films with various nanofiller loadingswere prepared via a solution casting method to simultaneously improve the electrical conductivity andfracture toughness of carbon fiber/epoxy (CF/EP) composites. The films were interleaved between CF/EPprepreg layers and melted to bond with the matrix during the curing process. To improve the interfacialcompatibility and adhesion between the conductive thermoplastic films (CTFs) and the epoxy matrix, theCTFs were perforated and then subjected to a low temperature oxygen plasma treatment beforeinterleaving. Fourier transform infrared (FTIR) spectra results confirm that oxygen-containing functionalgroups were introduced on the surface of the CTFs, and experimental results demonstrate that theelectrical conductivity of the laminates was significantly improved. There was a 2-fold increase in thetransverse direction electrical conductivity of the laminate with 0.7 wt{\%} MWCNT loading and a 21-foldincrease in the through-thickness direction. Double cantilever beam (DCB) tests demonstrated that theMode-I fracture toughness (GIC) and resistance (GIR) of the same laminates significantly increased by 59{\%}and 113{\%}, respectively. Enhancements of both interlaminar fracture toughness and electrical conductivityare mainly attributed to the strong interfacial adhesion achieved after plasma treatment and to thebridging effect of the carbon nanotubes.",
author = "Wei Li and Dong Xiang and Lei Wang and Eileen Harkin-Jones and Chunxia Zhao and Bin Wang and Yuntao Li",
year = "2018",
month = "7",
day = "30",
doi = "10.1039/c8ra05366a",
language = "English",
volume = "8",
pages = "26910--26921",
journal = "RSC Advances",
issn = "2046-2069",
publisher = "Royal Society of Chemistry",

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Simultaneous enhancement of electrical conductivity and interlaminar fracture toughness of carbon fiber/epoxy composites using plasma treated conductive thermoplastic film interleaves. / Li, Wei; Xiang, Dong; Wang, Lei; Harkin-Jones, Eileen; Zhao, Chunxia; Wang, Bin; Li, Yuntao.

In: RSC Advances, Vol. 8, 30.07.2018, p. 26910-26921.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Simultaneous enhancement of electrical conductivity and interlaminar fracture toughness of carbon fiber/epoxy composites using plasma treated conductive thermoplastic film interleaves

AU - Li, Wei

AU - Xiang, Dong

AU - Wang, Lei

AU - Harkin-Jones, Eileen

AU - Zhao, Chunxia

AU - Wang, Bin

AU - Li, Yuntao

PY - 2018/7/30

Y1 - 2018/7/30

N2 - Multiwalled carbon nanotube (MWCNT)-doped polyamide 12 (PA12) films with various nanofiller loadingswere prepared via a solution casting method to simultaneously improve the electrical conductivity andfracture toughness of carbon fiber/epoxy (CF/EP) composites. The films were interleaved between CF/EPprepreg layers and melted to bond with the matrix during the curing process. To improve the interfacialcompatibility and adhesion between the conductive thermoplastic films (CTFs) and the epoxy matrix, theCTFs were perforated and then subjected to a low temperature oxygen plasma treatment beforeinterleaving. Fourier transform infrared (FTIR) spectra results confirm that oxygen-containing functionalgroups were introduced on the surface of the CTFs, and experimental results demonstrate that theelectrical conductivity of the laminates was significantly improved. There was a 2-fold increase in thetransverse direction electrical conductivity of the laminate with 0.7 wt% MWCNT loading and a 21-foldincrease in the through-thickness direction. Double cantilever beam (DCB) tests demonstrated that theMode-I fracture toughness (GIC) and resistance (GIR) of the same laminates significantly increased by 59%and 113%, respectively. Enhancements of both interlaminar fracture toughness and electrical conductivityare mainly attributed to the strong interfacial adhesion achieved after plasma treatment and to thebridging effect of the carbon nanotubes.

AB - Multiwalled carbon nanotube (MWCNT)-doped polyamide 12 (PA12) films with various nanofiller loadingswere prepared via a solution casting method to simultaneously improve the electrical conductivity andfracture toughness of carbon fiber/epoxy (CF/EP) composites. The films were interleaved between CF/EPprepreg layers and melted to bond with the matrix during the curing process. To improve the interfacialcompatibility and adhesion between the conductive thermoplastic films (CTFs) and the epoxy matrix, theCTFs were perforated and then subjected to a low temperature oxygen plasma treatment beforeinterleaving. Fourier transform infrared (FTIR) spectra results confirm that oxygen-containing functionalgroups were introduced on the surface of the CTFs, and experimental results demonstrate that theelectrical conductivity of the laminates was significantly improved. There was a 2-fold increase in thetransverse direction electrical conductivity of the laminate with 0.7 wt% MWCNT loading and a 21-foldincrease in the through-thickness direction. Double cantilever beam (DCB) tests demonstrated that theMode-I fracture toughness (GIC) and resistance (GIR) of the same laminates significantly increased by 59%and 113%, respectively. Enhancements of both interlaminar fracture toughness and electrical conductivityare mainly attributed to the strong interfacial adhesion achieved after plasma treatment and to thebridging effect of the carbon nanotubes.

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