Simultaneous enhancement of electrical conductivity and interlaminar fracture toughness of carbon fibre/epoxy composites using plasma treated conductive thermoplastic interleaves

Wei Li, Dong Xiang, Lei Wang, Eileen Harkin-Jones, Chunxia Zhao, Bin Wang, Yuntao Li

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Multiwalled carbon nanotube (MWCNT)-doped polyamide 12 (PA12) films with various nanofiller loadings were prepared via a solution casting method to simultaneously improve the electrical conductivity and fracture toughness of carbon fiber/epoxy (CF/EP) composites. The films were interleaved between CF/EP prepreg layers and melted to bond with the matrix during the curing process. To improve the interfacial compatibility and adhesion between the conductive thermoplastic films (CTFs) and the epoxy matrix, the CTFs were perforated and then subjected to a low temperature oxygen plasma treatment before interleaving. Fourier transform infrared (FTIR) spectra results confirm that oxygen-containing functional groups were introduced on the surface of the CTFs, and experimental results demonstrate that the electrical conductivity of the laminates was significantly improved. There was a 2-fold increase in the transverse direction electrical conductivity of the laminate with 0.7 wt% MWCNT loading and a 21-fold increase in the through-thickness direction. Double cantilever beam (DCB) tests demonstrated that the Mode-I fracture toughness (GIC) and resistance (GIR) of the same laminates significantly increased by 59% and 113%, respectively. Enhancements of both interlaminar fracture toughness and electrical conductivity are mainly attributed to the strong interfacial adhesion achieved after plasma treatment and to the bridging effect of the carbon nanotubes.
LanguageEnglish
JournalRSC Advances
Early online date2018
DOIs
Publication statusE-pub ahead of print - 2018

Fingerprint

Thermoplastics
Fracture toughness
Plasmas
Composite materials
Laminates
Multiwalled carbon nanotubes (MWCN)
Adhesion
Oxygen
Carbon Nanotubes
Cantilever beams
Functional groups
Curing
Fourier transforms
Casting
Electric Conductivity
carbon fiber
Infrared radiation
Temperature
Direction compound

Cite this

@article{78ec7e3c9239416e9ffa774038f09f7a,
title = "Simultaneous enhancement of electrical conductivity and interlaminar fracture toughness of carbon fibre/epoxy composites using plasma treated conductive thermoplastic interleaves",
abstract = "Multiwalled carbon nanotube (MWCNT)-doped polyamide 12 (PA12) films with various nanofiller loadings were prepared via a solution casting method to simultaneously improve the electrical conductivity and fracture toughness of carbon fiber/epoxy (CF/EP) composites. The films were interleaved between CF/EP prepreg layers and melted to bond with the matrix during the curing process. To improve the interfacial compatibility and adhesion between the conductive thermoplastic films (CTFs) and the epoxy matrix, the CTFs were perforated and then subjected to a low temperature oxygen plasma treatment before interleaving. Fourier transform infrared (FTIR) spectra results confirm that oxygen-containing functional groups were introduced on the surface of the CTFs, and experimental results demonstrate that the electrical conductivity of the laminates was significantly improved. There was a 2-fold increase in the transverse direction electrical conductivity of the laminate with 0.7 wt{\%} MWCNT loading and a 21-fold increase in the through-thickness direction. Double cantilever beam (DCB) tests demonstrated that the Mode-I fracture toughness (GIC) and resistance (GIR) of the same laminates significantly increased by 59{\%} and 113{\%}, respectively. Enhancements of both interlaminar fracture toughness and electrical conductivity are mainly attributed to the strong interfacial adhesion achieved after plasma treatment and to the bridging effect of the carbon nanotubes.",
author = "Wei Li and Dong Xiang and Lei Wang and Eileen Harkin-Jones and Chunxia Zhao and Bin Wang and Yuntao Li",
year = "2018",
doi = "10.1039/c8ra05366a",
language = "English",
journal = "RSC Advances",
issn = "2046-2069",
publisher = "Royal Society of Chemistry",

}

TY - JOUR

T1 - Simultaneous enhancement of electrical conductivity and interlaminar fracture toughness of carbon fibre/epoxy composites using plasma treated conductive thermoplastic interleaves

AU - Li, Wei

AU - Xiang, Dong

AU - Wang, Lei

AU - Harkin-Jones, Eileen

AU - Zhao, Chunxia

AU - Wang, Bin

AU - Li, Yuntao

PY - 2018

Y1 - 2018

N2 - Multiwalled carbon nanotube (MWCNT)-doped polyamide 12 (PA12) films with various nanofiller loadings were prepared via a solution casting method to simultaneously improve the electrical conductivity and fracture toughness of carbon fiber/epoxy (CF/EP) composites. The films were interleaved between CF/EP prepreg layers and melted to bond with the matrix during the curing process. To improve the interfacial compatibility and adhesion between the conductive thermoplastic films (CTFs) and the epoxy matrix, the CTFs were perforated and then subjected to a low temperature oxygen plasma treatment before interleaving. Fourier transform infrared (FTIR) spectra results confirm that oxygen-containing functional groups were introduced on the surface of the CTFs, and experimental results demonstrate that the electrical conductivity of the laminates was significantly improved. There was a 2-fold increase in the transverse direction electrical conductivity of the laminate with 0.7 wt% MWCNT loading and a 21-fold increase in the through-thickness direction. Double cantilever beam (DCB) tests demonstrated that the Mode-I fracture toughness (GIC) and resistance (GIR) of the same laminates significantly increased by 59% and 113%, respectively. Enhancements of both interlaminar fracture toughness and electrical conductivity are mainly attributed to the strong interfacial adhesion achieved after plasma treatment and to the bridging effect of the carbon nanotubes.

AB - Multiwalled carbon nanotube (MWCNT)-doped polyamide 12 (PA12) films with various nanofiller loadings were prepared via a solution casting method to simultaneously improve the electrical conductivity and fracture toughness of carbon fiber/epoxy (CF/EP) composites. The films were interleaved between CF/EP prepreg layers and melted to bond with the matrix during the curing process. To improve the interfacial compatibility and adhesion between the conductive thermoplastic films (CTFs) and the epoxy matrix, the CTFs were perforated and then subjected to a low temperature oxygen plasma treatment before interleaving. Fourier transform infrared (FTIR) spectra results confirm that oxygen-containing functional groups were introduced on the surface of the CTFs, and experimental results demonstrate that the electrical conductivity of the laminates was significantly improved. There was a 2-fold increase in the transverse direction electrical conductivity of the laminate with 0.7 wt% MWCNT loading and a 21-fold increase in the through-thickness direction. Double cantilever beam (DCB) tests demonstrated that the Mode-I fracture toughness (GIC) and resistance (GIR) of the same laminates significantly increased by 59% and 113%, respectively. Enhancements of both interlaminar fracture toughness and electrical conductivity are mainly attributed to the strong interfacial adhesion achieved after plasma treatment and to the bridging effect of the carbon nanotubes.

U2 - 10.1039/c8ra05366a

DO - 10.1039/c8ra05366a

M3 - Article

JO - RSC Advances

T2 - RSC Advances

JF - RSC Advances

SN - 2046-2069

ER -