Semiconductor wafer comprising micro-machined components

CS Gormley (Inventor), A Brown (Inventor), SC Blackstone (Inventor)

Research output: Patent

Abstract

A semiconductor wafer having a matrix array of micro-mirrors comprises a component substrate carried on a base substrate. The component substrate comprises a membrane layer in which the micro-mirrors are formed and a supporting handle layer. The base substrate comprises a base layer from which a plurality of pedestals extend upwardly therefrom into cavities in the handle layer corresponding to the micro-mirrors. Each pedestal carries electrodes for co-operating with the micro-mirrors for tilting thereof. Conductors through vias in the pedestals connect the electrodes to electrically conductive tracks on a bottom surface, and in turn through conductors through vias to addressing terminals for addressing the electrodes. By forming the pedestals in the base substrate and projecting the pedestals into the cavities in the handle layer the handle layer is recessed into the base substrate thereby facilitating the provision of a handle layer of depth sufficient for adequately supporting the membrane layer during fabrication of the wafer.
LanguageEnglish
Patent number10/786426
Priority date16/05/06
Publication statusPublished - 25 Feb 2004

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Semiconductor materials
Mirrors
Substrates
Electrodes
Membranes
Fabrication

Cite this

Gormley, CS., Brown, A., & Blackstone, SC. (2004). Semiconductor wafer comprising micro-machined components. (Patent No. 10/786426).
Gormley, CS (Inventor) ; Brown, A (Inventor) ; Blackstone, SC (Inventor). / Semiconductor wafer comprising micro-machined components. Patent No.: 10/786426.
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title = "Semiconductor wafer comprising micro-machined components",
abstract = "A semiconductor wafer having a matrix array of micro-mirrors comprises a component substrate carried on a base substrate. The component substrate comprises a membrane layer in which the micro-mirrors are formed and a supporting handle layer. The base substrate comprises a base layer from which a plurality of pedestals extend upwardly therefrom into cavities in the handle layer corresponding to the micro-mirrors. Each pedestal carries electrodes for co-operating with the micro-mirrors for tilting thereof. Conductors through vias in the pedestals connect the electrodes to electrically conductive tracks on a bottom surface, and in turn through conductors through vias to addressing terminals for addressing the electrodes. By forming the pedestals in the base substrate and projecting the pedestals into the cavities in the handle layer the handle layer is recessed into the base substrate thereby facilitating the provision of a handle layer of depth sufficient for adequately supporting the membrane layer during fabrication of the wafer.",
author = "CS Gormley and A Brown and SC Blackstone",
note = "Country: United States of America Commercialisation Status: assigned Patent Application Date: 2004-02-25; 10/786426",
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Gormley, CS, Brown, A & Blackstone, SC 2004, Semiconductor wafer comprising micro-machined components, Patent No. 10/786426.

Semiconductor wafer comprising micro-machined components. / Gormley, CS (Inventor); Brown, A (Inventor); Blackstone, SC (Inventor).

Patent No.: 10/786426.

Research output: Patent

TY - PAT

T1 - Semiconductor wafer comprising micro-machined components

AU - Gormley, CS

AU - Brown, A

AU - Blackstone, SC

N1 - Country: United States of America Commercialisation Status: assigned Patent Application Date: 2004-02-25

PY - 2004/2/25

Y1 - 2004/2/25

N2 - A semiconductor wafer having a matrix array of micro-mirrors comprises a component substrate carried on a base substrate. The component substrate comprises a membrane layer in which the micro-mirrors are formed and a supporting handle layer. The base substrate comprises a base layer from which a plurality of pedestals extend upwardly therefrom into cavities in the handle layer corresponding to the micro-mirrors. Each pedestal carries electrodes for co-operating with the micro-mirrors for tilting thereof. Conductors through vias in the pedestals connect the electrodes to electrically conductive tracks on a bottom surface, and in turn through conductors through vias to addressing terminals for addressing the electrodes. By forming the pedestals in the base substrate and projecting the pedestals into the cavities in the handle layer the handle layer is recessed into the base substrate thereby facilitating the provision of a handle layer of depth sufficient for adequately supporting the membrane layer during fabrication of the wafer.

AB - A semiconductor wafer having a matrix array of micro-mirrors comprises a component substrate carried on a base substrate. The component substrate comprises a membrane layer in which the micro-mirrors are formed and a supporting handle layer. The base substrate comprises a base layer from which a plurality of pedestals extend upwardly therefrom into cavities in the handle layer corresponding to the micro-mirrors. Each pedestal carries electrodes for co-operating with the micro-mirrors for tilting thereof. Conductors through vias in the pedestals connect the electrodes to electrically conductive tracks on a bottom surface, and in turn through conductors through vias to addressing terminals for addressing the electrodes. By forming the pedestals in the base substrate and projecting the pedestals into the cavities in the handle layer the handle layer is recessed into the base substrate thereby facilitating the provision of a handle layer of depth sufficient for adequately supporting the membrane layer during fabrication of the wafer.

M3 - Patent

M1 - 10/786426

ER -

Gormley CS, Brown A, Blackstone SC, inventors. Semiconductor wafer comprising micro-machined components. 10/786426. 2004 Feb 25.