We developed a safe technique without using a toxic gas source to deposit tungsten oxide on a localized specific area using an atmospheric pressure microplasma jet. In this technique, a consumable tungsten wire, inserted into a quartz nozzle for microplasma generation, was etched with an O-2/Ar microplasma, and the resultant tungsten oxide was deposited on the substrate placed downstream. The process mechanism was determined by the detailed observation of the deposit and consumed wire surface after processing, and optical emission spectroscopy. This technique is expected to be utilized for the localized deposition of a variety of metal oxides by varying the kind of consumable metal wire.
|Journal||JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS|
|Early online date||24 Oct 2006|
|Publication status||E-pub ahead of print - 24 Oct 2006|
Shimizu, Y., Bose, AC., Mariotti, D., Sasaki, T., Kirihara, K., Suzuki, T., Terashima, K., & Koshizaki, N. (2006). Reactive evaporation of metal wire and microdeposition of metal oxide using atmospheric pressure reactive microplasma jet. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 45(10B), 8228-8234. https://doi.org/10.1143/JJAP.45.8228