Properties of NiAl and Ni-Al-N Thin Films Deposited by Closed Field Unbalanced Magnetron Sputter Ion Plating Using Elemental Ni and Al Targets

Approximately 1 mu m thick NiAl and Ni-Al-N thin films have been deposited from individual elemental Ni (99.5% pure) and Al (99.5% pure) targets onto glass and stainless steel 316 substrates using closed field unbalanced magnetron sputter ion platting (CFUBMSIP) process. The films have been characterized using stylus profilometry, energy dispersive spectroscopy (EDAX), X-ray diffractometry (XRD) and atomic force microscopy (AFM). The X-ray diffraction patterns of both types of thin films produced confirmed the formation of beta-NiAl phase. The EDAX results revealed that all of the NiAl thin films produced exhibited the near equiatomic NiAl phase with the best results given by the one deposited using 300 Watts DC power for Ni and 400 Watts DC power for Al targets respectively. However, the Ni-Al-N thin films showed a Ni-rich NiAl phase. AFM results of both types of films produced carried out on glass samples exhibited that the coatings have quite a smooth surface with surface roughness in nanometres range.