Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation

Y Zhang, YC Shen, K Shi, TW Wang, Eileen Harkin-Jones

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Diglycidyl ethers of bisphenol-A (DGEBA)/methyl tetrahydrophthalic anhydride/polyethersulphone (PES) blends are prepared as matrix resins for thermally conductive composites using graphite nanoplatelets (GNPs) as the conductive component. The epoxy/PES blends form a network structure via reaction-induced phase separation (RIPS) during the curing process, and the GNPs are selectively localized in the PES phase and at the interface leading to a three-dimensional continuous filler network. With this unique structure, the thermal conductivity of the epoxy/PES/10 wt% GNPs composite is increased to 0.709 W m-1 K-1, which is nearly 3.5 times that of the pure epoxy or a 52% increase compared to the epoxy/GNP composite without PES. In addition, it is found that the impact strength of the composite relative to the unfilled
material is also improved.
LanguageEnglish
Pages62-69
Number of pages8
JournalComposites Part A: Applied Science and Manufacturing
Volume110
Early online date12 Apr 2018
DOIs
Publication statusPublished - Jul 2018

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Phase separation
Fillers
Thermal conductivity
Graphite
Composite materials
Graphite epoxy composites
Impact strength
Curing
Ethers
Resins
Anhydrides
polyether sulfone

Keywords

  • Cure
  • Thermal properties
  • Polymer-matrix composites (PMCs)

Cite this

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title = "Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation",
abstract = "Diglycidyl ethers of bisphenol-A (DGEBA)/methyl tetrahydrophthalic anhydride/polyethersulphone (PES) blends are prepared as matrix resins for thermally conductive composites using graphite nanoplatelets (GNPs) as the conductive component. The epoxy/PES blends form a network structure via reaction-induced phase separation (RIPS) during the curing process, and the GNPs are selectively localized in the PES phase and at the interface leading to a three-dimensional continuous filler network. With this unique structure, the thermal conductivity of the epoxy/PES/10 wt{\%} GNPs composite is increased to 0.709 W m-1 K-1, which is nearly 3.5 times that of the pure epoxy or a 52{\%} increase compared to the epoxy/GNP composite without PES. In addition, it is found that the impact strength of the composite relative to the unfilledmaterial is also improved.",
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TY - JOUR

T1 - Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation

AU - Zhang, Y

AU - Shen, YC

AU - Shi, K

AU - Wang, TW

AU - Harkin-Jones, Eileen

PY - 2018/7

Y1 - 2018/7

N2 - Diglycidyl ethers of bisphenol-A (DGEBA)/methyl tetrahydrophthalic anhydride/polyethersulphone (PES) blends are prepared as matrix resins for thermally conductive composites using graphite nanoplatelets (GNPs) as the conductive component. The epoxy/PES blends form a network structure via reaction-induced phase separation (RIPS) during the curing process, and the GNPs are selectively localized in the PES phase and at the interface leading to a three-dimensional continuous filler network. With this unique structure, the thermal conductivity of the epoxy/PES/10 wt% GNPs composite is increased to 0.709 W m-1 K-1, which is nearly 3.5 times that of the pure epoxy or a 52% increase compared to the epoxy/GNP composite without PES. In addition, it is found that the impact strength of the composite relative to the unfilledmaterial is also improved.

AB - Diglycidyl ethers of bisphenol-A (DGEBA)/methyl tetrahydrophthalic anhydride/polyethersulphone (PES) blends are prepared as matrix resins for thermally conductive composites using graphite nanoplatelets (GNPs) as the conductive component. The epoxy/PES blends form a network structure via reaction-induced phase separation (RIPS) during the curing process, and the GNPs are selectively localized in the PES phase and at the interface leading to a three-dimensional continuous filler network. With this unique structure, the thermal conductivity of the epoxy/PES/10 wt% GNPs composite is increased to 0.709 W m-1 K-1, which is nearly 3.5 times that of the pure epoxy or a 52% increase compared to the epoxy/GNP composite without PES. In addition, it is found that the impact strength of the composite relative to the unfilledmaterial is also improved.

KW - Cure

KW - Thermal properties

KW - Polymer-matrix composites (PMCs)

U2 - 10.1016/j.compositesa.2018.04.009

DO - 10.1016/j.compositesa.2018.04.009

M3 - Article

VL - 110

SP - 62

EP - 69

JO - Composites Part A: Applied Science and Manufacturing

T2 - Composites Part A: Applied Science and Manufacturing

JF - Composites Part A: Applied Science and Manufacturing

SN - 1359-835X

ER -