Characterisation of PMMA microfluidic channels and devices fabricated by hot embossing and sealed by direct bonding

A Mathur, SS Roy, M Tweedie, S Mukhopadhyay, SK Mitra, JAD McLaughlin

Research output: Contribution to journalArticle

52 Citations (Scopus)

Abstract

In this study we fabricated a silicon-based stamp with various microchannel arrays, and demonstrated successful replication of the stamp microstructure on poly methyl methacrylate (PMMA) substrates. We used maskless UV lithography for the production of the micro-structured stamp. Thermal imprint lithography was used to fabricate microfeatured fluidic platforms on PMMA substrates, as well as to bond PMMA lids on the fluidic platforms. The microfeature in the silicon-based (silicon wafer coated with SU-8) stamp includes microchannel arrays of approximately 30 mu m in depth and 5 mm in width. We produced various channels without pillars, as well as with SU-8 pillars in the range of 50-100 mu m wide and 6 pm in height. PMMA discs of 1 mm thickness were utilized as the molding substrate. We found 10 kN applied force and 100 degrees C embossing temperature were optimum for transferring the microstructure to the PMMA substrate. (C) 2009 Elsevier B.V. All rights reserved.
LanguageEnglish
Pages1199-1202
JournalCurrent Applied Physics
Volume9
Issue number6
DOIs
Publication statusPublished - Nov 2009

Fingerprint

embossing
Polymethyl Methacrylate
Polymethyl methacrylates
Microfluidics
polymethyl methacrylate
fluidics
Fluidics
Silicon
Substrates
microchannels
Microchannels
Lithography
silicon
lithography
platforms
microstructure
Microstructure
Silicon wafers
Molding
wafers

Keywords

  • Microfluidics
  • Surface energy
  • Hot embossing
  • Thermal bonding
  • Surface roughening

Cite this

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title = "Characterisation of PMMA microfluidic channels and devices fabricated by hot embossing and sealed by direct bonding",
abstract = "In this study we fabricated a silicon-based stamp with various microchannel arrays, and demonstrated successful replication of the stamp microstructure on poly methyl methacrylate (PMMA) substrates. We used maskless UV lithography for the production of the micro-structured stamp. Thermal imprint lithography was used to fabricate microfeatured fluidic platforms on PMMA substrates, as well as to bond PMMA lids on the fluidic platforms. The microfeature in the silicon-based (silicon wafer coated with SU-8) stamp includes microchannel arrays of approximately 30 mu m in depth and 5 mm in width. We produced various channels without pillars, as well as with SU-8 pillars in the range of 50-100 mu m wide and 6 pm in height. PMMA discs of 1 mm thickness were utilized as the molding substrate. We found 10 kN applied force and 100 degrees C embossing temperature were optimum for transferring the microstructure to the PMMA substrate. (C) 2009 Elsevier B.V. All rights reserved.",
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Characterisation of PMMA microfluidic channels and devices fabricated by hot embossing and sealed by direct bonding. / Mathur, A; Roy, SS; Tweedie, M; Mukhopadhyay, S; Mitra, SK; McLaughlin, JAD.

In: Current Applied Physics, Vol. 9, No. 6, 11.2009, p. 1199-1202.

Research output: Contribution to journalArticle

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AU - Mathur, A

AU - Roy, SS

AU - Tweedie, M

AU - Mukhopadhyay, S

AU - Mitra, SK

AU - McLaughlin, JAD

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AB - In this study we fabricated a silicon-based stamp with various microchannel arrays, and demonstrated successful replication of the stamp microstructure on poly methyl methacrylate (PMMA) substrates. We used maskless UV lithography for the production of the micro-structured stamp. Thermal imprint lithography was used to fabricate microfeatured fluidic platforms on PMMA substrates, as well as to bond PMMA lids on the fluidic platforms. The microfeature in the silicon-based (silicon wafer coated with SU-8) stamp includes microchannel arrays of approximately 30 mu m in depth and 5 mm in width. We produced various channels without pillars, as well as with SU-8 pillars in the range of 50-100 mu m wide and 6 pm in height. PMMA discs of 1 mm thickness were utilized as the molding substrate. We found 10 kN applied force and 100 degrees C embossing temperature were optimum for transferring the microstructure to the PMMA substrate. (C) 2009 Elsevier B.V. All rights reserved.

KW - Microfluidics

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KW - Thermal bonding

KW - Surface roughening

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