Abstract
Language | English |
---|---|
Pages | 365-374 |
Journal | Journal of Electronic Testing |
Volume | 28 |
Issue number | 3 |
Publication status | Published - 15 Jun 2012 |
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Keywords
- Semiconductor test
- software quality
- productivity
- automated test equipment
- system-on-a-chip test
- mixed-signal test
- test engineering
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Challenges for Semiconductor Test Engineering: A Review Paper. / Vock, Stefan R; Escalona, OJ; Turner, Colin; Owens, FJ.
In: Journal of Electronic Testing, Vol. 28, No. 3, 15.06.2012, p. 365-374.Research output: Contribution to journal › Article
TY - JOUR
T1 - Challenges for Semiconductor Test Engineering: A Review Paper
AU - Vock, Stefan R
AU - Escalona, OJ
AU - Turner, Colin
AU - Owens, FJ
PY - 2012/6/15
Y1 - 2012/6/15
N2 - Today’s economical cycles challenge the test program generation process for semiconductors with regard to productivity, time-to-market, increasing quality requirements and manufacturing robustness, while, at the same time, the complexity of the system-on-a-chip mixed-signal integrated circuits to be tested increases significantly. Furthermore, commercial challenges in combination with competitive advantage become an important factor, not only within semiconductor manufacturing, but also within test program development. This paper provides a review of these challenges, and how they might be addressed. We first give a short introduction and background on semiconductor testing and test development with the focus on mixed-signal and systems-on-chip. This is followed by current roadmaps and considerations for test program software development. Based on the highlighted strength and weaknesses of the reviewed approaches, the authors conclude with some recommendations to address these challenges by adopting software engineering methods for the test program development process.
AB - Today’s economical cycles challenge the test program generation process for semiconductors with regard to productivity, time-to-market, increasing quality requirements and manufacturing robustness, while, at the same time, the complexity of the system-on-a-chip mixed-signal integrated circuits to be tested increases significantly. Furthermore, commercial challenges in combination with competitive advantage become an important factor, not only within semiconductor manufacturing, but also within test program development. This paper provides a review of these challenges, and how they might be addressed. We first give a short introduction and background on semiconductor testing and test development with the focus on mixed-signal and systems-on-chip. This is followed by current roadmaps and considerations for test program software development. Based on the highlighted strength and weaknesses of the reviewed approaches, the authors conclude with some recommendations to address these challenges by adopting software engineering methods for the test program development process.
KW - Semiconductor test
KW - software quality
KW - productivity
KW - automated test equipment
KW - system-on-a-chip test
KW - mixed-signal test
KW - test engineering
M3 - Article
VL - 28
SP - 365
EP - 374
JO - Journal of Electronic Testing
T2 - Journal of Electronic Testing
JF - Journal of Electronic Testing
SN - 0923-8174
IS - 3
ER -