Multivariate batch time-series data sets within Semiconductor manufacturing processes present a difficult environment for effective Anomaly Detection (AD). The challenge is amplified by the limited availability of ground truth labelled data. In scenarios where AD is possible, black box modelling approaches constrain model interpretability. These challenges obstruct the widespread adoption of Deep Learning solutions. The objective of the study is to demonstrate an AD approach which employs 1-Dimensional Convolutional AutoEncoders (1d-CAE) and Localised Reconstruction Error (LRE) to improve AD performance and interpretability. Using LRE to identify sensors and data that result in the anomaly, the explainability of the Deep Learning solution is enhanced. The Tennessee Eastman Process (TEP) and LAM 9600 Metal Etcher datasets have been utilised to validate the proposed framework. The results show that the proposed LRE approach outperforms global reconstruction errors for similar model architectures achieving an AUC of 1.00. The proposed unsupervised learning approach with AE and LRE improves model explainability which is expected to be beneficial for deployment in semiconductor manufacturing where trustworthy results are critical and interpretable by process engineering teams.
- Deep Learning
- Fault Detection and Classification
- Semiconductor Manufacturing
- Reconstruction Error
- Anomaly Detection