Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

Mohammad Alibakhshikenari, Bal S. Virdee, Chan H. See, Sam Jeffery Fishlock, Navneet Soin, James McLaughlin, Raed A. Abd-Alhameed, Ernesto Limiti

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Citation (Scopus)

Abstract

This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.

Original languageEnglish
Title of host publication2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages673-674
Number of pages2
ISBN (Electronic)9781665400541
DOIs
Publication statusPublished - 4 Aug 2019
Event8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019 - Incheon, Korea, Republic of
Duration: 4 Aug 20197 Aug 2019

Publication series

Name2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

Conference

Conference8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019
Country/TerritoryKorea, Republic of
CityIncheon
Period4/08/197/08/19

Keywords

  • feeding mechanism
  • high-efficiency
  • metamaterial
  • On-chip antenna
  • silicon
  • substrate integrated waveguide
  • terahertz
  • wideband

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