Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

Mohammad Alibakhshikenari; Bal S. Virdee; Chan H. See; Sam Jeffery Fishlock; Navneet Soin; James McLaughlin; Raed A. Abd-Alhameed; Ernesto Limiti

doi:10.1109/APCAP47827.2019.9472184

Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

Mohammad Alibakhshikenari, Bal S. Virdee, Chan H. See, Sam Jeffery Fishlock, Navneet Soin, James McLaughlin, Raed A. Abd-Alhameed, Ernesto Limiti

School of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Citations (Scopus)

Abstract

This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.

Original language	English
Title of host publication	2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	673-674
Number of pages	2
ISBN (Electronic)	9781665400541
DOIs	https://doi.org/10.1109/APCAP47827.2019.9472184
Publication status	Published (in print/issue) - 4 Aug 2019
Event	8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019 - Incheon, Korea, Republic of Duration: 4 Aug 2019 → 7 Aug 2019

Publication series

Name	2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

Conference

Conference	8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019
Country/Territory	Korea, Republic of
City	Incheon
Period	4/08/19 → 7/08/19

Bibliographical note

Funding Information:
This work is partially supported by innovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424 and the financial support from the UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E022936/1. REFERENCES

Publisher Copyright:
© 2019 IEEE.

Keywords

feeding mechanism
high-efficiency
metamaterial
On-chip antenna
silicon
substrate integrated waveguide
terahertz
wideband

Access to Document

10.1109/APCAP47827.2019.9472184

Cite this

Alibakhshikenari, M., Virdee, B. S., See, C. H., Fishlock, S. J., Soin, N., McLaughlin, J., Abd-Alhameed, R. A., & Limiti, E. (2019). Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. In 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019 (pp. 673-674). Article 9472184 (2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APCAP47827.2019.9472184

Alibakhshikenari, Mohammad ; Virdee, Bal S. ; See, Chan H. et al. / Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 673-674 (2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019).

@inproceedings{6884519be22747b0a6e951d65ee99e3f,

title = "Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components",

abstract = "This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.",

keywords = "feeding mechanism, high-efficiency, metamaterial, On-chip antenna, silicon, substrate integrated waveguide, terahertz, wideband",

author = "Mohammad Alibakhshikenari and Virdee, {Bal S.} and See, {Chan H.} and Fishlock, {Sam Jeffery} and Navneet Soin and James McLaughlin and Abd-Alhameed, {Raed A.} and Ernesto Limiti",

note = "Funding Information: This work is partially supported by innovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424 and the financial support from the UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E022936/1. REFERENCES Publisher Copyright: {\textcopyright} 2019 IEEE.; 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019 ; Conference date: 04-08-2019 Through 07-08-2019",

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doi = "10.1109/APCAP47827.2019.9472184",

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Alibakhshikenari, M, Virdee, BS, See, CH, Fishlock, SJ, Soin, N, McLaughlin, J, Abd-Alhameed, RA & Limiti, E 2019, Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. in 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019., 9472184, 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 673-674, 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019, Incheon, Korea, Republic of, 4/08/19. https://doi.org/10.1109/APCAP47827.2019.9472184

Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. / Alibakhshikenari, Mohammad; Virdee, Bal S.; See, Chan H. et al.
2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 673-674 9472184 (2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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T1 - Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

AU - Alibakhshikenari, Mohammad

AU - Virdee, Bal S.

AU - See, Chan H.

AU - Fishlock, Sam Jeffery

AU - Soin, Navneet

AU - McLaughlin, James

AU - Abd-Alhameed, Raed A.

AU - Limiti, Ernesto

N1 - Funding Information: This work is partially supported by innovation programme under grant agreement H2020-MSCA-ITN-2016 SECRET-722424 and the financial support from the UK Engineering and Physical Sciences Research Council (EPSRC) under grant EP/E022936/1. REFERENCES Publisher Copyright: © 2019 IEEE.

PY - 2019/8/4

Y1 - 2019/8/4

N2 - This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.

AB - This paper shows that by employing a combination of metamaterial (MTM) and substrate integrated waveguide (SIW) technologies, the drawbacks of narrow-bandwidth and low radiation properties encountered in terahertz on-chip antennas can be overcome. In addition, an effective feeding mechanism is introduced to excite the on-chip antenna. The proposed antenna is constructed on the three stacked layers comprising Silicon-metal-Silicon substrates. Dimensions of on-chip antenna are 1×1×0.265 mm3. The on-chip antenna is shown to have an average impedance match, gain, and efficiency parameters of-35dB, 8.5dBi, and 67.5%, respectively, over a wide frequency range of 0.20-0.22 THz.

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KW - high-efficiency

KW - metamaterial

KW - On-chip antenna

KW - silicon

KW - substrate integrated waveguide

KW - terahertz

KW - wideband

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U2 - 10.1109/APCAP47827.2019.9472184

DO - 10.1109/APCAP47827.2019.9472184

M3 - Conference contribution

AN - SCOPUS:85092195025

T3 - 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

SP - 673

EP - 674

BT - 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019

Y2 - 4 August 2019 through 7 August 2019

ER -

Alibakhshikenari M, Virdee BS, See CH, Fishlock SJ, Soin N, McLaughlin J et al. Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components. In 2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 673-674. 9472184. (2019 8th Asia-Pacific Conference on Antennas and Propagation, APCAP 2019). doi: 10.1109/APCAP47827.2019.9472184

Amalgamation of Metamaterial and SIW Technologies for Realizing Wide-Bandwidth and High-Radiation Properties of On-Chip Antennas for Application in Packaging of Terahertz Components

Abstract

Publication series

Conference

Bibliographical note

Keywords

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