Abstract
This paper presents a groundbreaking advancement
in industrial quality control through the development of an
automated soldering quality assessment system for circuit boards
utilizing hyperspectral imaging (HSI) technology. Building upon
the transformative capabilities of HSI in visual inspection, our
research focuses on enhancing the precision and depth of assessment in soldering processes, a critical aspect of electronics
manufacturing. By leveraging the unique spectral information
captured by HSI, beyond the capabilities of traditional vision
systems, our automated solution offers a comprehensive evaluation of solder quality, overcoming challenges posed by similar absorption characteristics of materials. We detail the methodology,
algorithms, and integration of HSI into the inspection pipeline,
highlighting its effectiveness in detecting defects, ensuring uniformity, and improving overall product quality. The application of
this technology extends beyond electronics manufacturing, with
potential implications for various industries requiring meticulous
quality control. Through this study, we contribute to the ongoing
evolution of visual inspection systems, empowering industries
with advanced tools for precise and reliable quality assessment.
in industrial quality control through the development of an
automated soldering quality assessment system for circuit boards
utilizing hyperspectral imaging (HSI) technology. Building upon
the transformative capabilities of HSI in visual inspection, our
research focuses on enhancing the precision and depth of assessment in soldering processes, a critical aspect of electronics
manufacturing. By leveraging the unique spectral information
captured by HSI, beyond the capabilities of traditional vision
systems, our automated solution offers a comprehensive evaluation of solder quality, overcoming challenges posed by similar absorption characteristics of materials. We detail the methodology,
algorithms, and integration of HSI into the inspection pipeline,
highlighting its effectiveness in detecting defects, ensuring uniformity, and improving overall product quality. The application of
this technology extends beyond electronics manufacturing, with
potential implications for various industries requiring meticulous
quality control. Through this study, we contribute to the ongoing
evolution of visual inspection systems, empowering industries
with advanced tools for precise and reliable quality assessment.
| Original language | English |
|---|---|
| Title of host publication | IEEE International Conference on Industrial Informatics (INDIN) |
| Publisher | IEEE |
| Number of pages | 6 |
| Publication status | Accepted/In press - 10 Jun 2024 |
| Event | 22nd IEEE International Conference on Industrial Informatics - Wyndham Beijing North，Beijing（Changping）, Beijing, China Duration: 17 Aug 2024 → 20 Aug 2024 https://indin2024.ieee-ies.org/ |
Conference
| Conference | 22nd IEEE International Conference on Industrial Informatics |
|---|---|
| Abbreviated title | 2024 INDIN |
| Country/Territory | China |
| City | Beijing |
| Period | 17/08/24 → 20/08/24 |
| Internet address |
Keywords
- Hyperspectral Imaging
- Electronics Manufacturing
- Solder Quality Assessment
