A novel method for fabricating sonic paper

Ming Wei Chang, Hsu Cheng Deng, Da Chen Pang, Mu Yue Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

This paper presents the research results related to a new type of flexible capacitive micromachined ultrasonic transducers (cMUT) named "Sonic Paper". In this study, the novel design concept, relevant processing steps, and characterization experiments associated with the Sonic Paper were introduced. Compared with the existing curved or flexible CMUT, the Sonic paper features in simpler fabrication steps, lower processing temperature (less than 120°C ) and higher flexibility. Fabricated from polymer-based materials and inherited the natural flexibility from these materials, the Sonic Paper may facilitate the development and implementation of numerous innovative curvature-conforming applications in the future.

Original languageEnglish
Title of host publication2007 IEEE Ultrasonics Symposium Proceedings, IUS
Pages527-530
Number of pages4
DOIs
Publication statusPublished - 1 Dec 2007
Event2007 IEEE Ultrasonics Symposium, IUS - New York, NY, United States
Duration: 28 Oct 200731 Oct 2007

Conference

Conference2007 IEEE Ultrasonics Symposium, IUS
CountryUnited States
CityNew York, NY
Period28/10/0731/10/07

Keywords

  • cMUT
  • Flexible
  • Polymer technology

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    Chang, M. W., Deng, H. C., Pang, D. C., & Chen, M. Y. (2007). A novel method for fabricating sonic paper. In 2007 IEEE Ultrasonics Symposium Proceedings, IUS (pp. 527-530). [4409712] https://doi.org/10.1109/ULTSYM.2007.139