A novel method for fabricating sonic paper

Ming Wei Chang, Hsu Cheng Deng, Da Chen Pang, Mu Yue Chen

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

This paper presents the research results related to a new type of flexible capacitive micromachined ultrasonic transducers (cMUT) named "Sonic Paper". In this study, the novel design concept, relevant processing steps, and characterization experiments associated with the Sonic Paper were introduced. Compared with the existing curved or flexible CMUT, the Sonic paper features in simpler fabrication steps, lower processing temperature (less than 120°C ) and higher flexibility. Fabricated from polymer-based materials and inherited the natural flexibility from these materials, the Sonic Paper may facilitate the development and implementation of numerous innovative curvature-conforming applications in the future.

LanguageEnglish
Title of host publication2007 IEEE Ultrasonics Symposium Proceedings, IUS
Pages527-530
Number of pages4
DOIs
Publication statusPublished - 1 Dec 2007
Event2007 IEEE Ultrasonics Symposium, IUS - New York, NY, United States
Duration: 28 Oct 200731 Oct 2007

Conference

Conference2007 IEEE Ultrasonics Symposium, IUS
CountryUnited States
CityNew York, NY
Period28/10/0731/10/07

Fingerprint

flexibility
transducers
ultrasonics
curvature
fabrication
polymers
temperature

Keywords

  • cMUT
  • Flexible
  • Polymer technology

Cite this

Chang, M. W., Deng, H. C., Pang, D. C., & Chen, M. Y. (2007). A novel method for fabricating sonic paper. In 2007 IEEE Ultrasonics Symposium Proceedings, IUS (pp. 527-530). [4409712] https://doi.org/10.1109/ULTSYM.2007.139
Chang, Ming Wei ; Deng, Hsu Cheng ; Pang, Da Chen ; Chen, Mu Yue. / A novel method for fabricating sonic paper. 2007 IEEE Ultrasonics Symposium Proceedings, IUS. 2007. pp. 527-530
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Chang, MW, Deng, HC, Pang, DC & Chen, MY 2007, A novel method for fabricating sonic paper. in 2007 IEEE Ultrasonics Symposium Proceedings, IUS., 4409712, pp. 527-530, 2007 IEEE Ultrasonics Symposium, IUS, New York, NY, United States, 28/10/07. https://doi.org/10.1109/ULTSYM.2007.139

A novel method for fabricating sonic paper. / Chang, Ming Wei; Deng, Hsu Cheng; Pang, Da Chen; Chen, Mu Yue.

2007 IEEE Ultrasonics Symposium Proceedings, IUS. 2007. p. 527-530 4409712.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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Chang MW, Deng HC, Pang DC, Chen MY. A novel method for fabricating sonic paper. In 2007 IEEE Ultrasonics Symposium Proceedings, IUS. 2007. p. 527-530. 4409712 https://doi.org/10.1109/ULTSYM.2007.139