A novel method for fabricating sonic paper

Ming Wei Chang; Hsu Cheng Deng; Da Chen Pang; Mu Yue Chen

doi:10.1109/ULTSYM.2007.139

A novel method for fabricating sonic paper

Ming Wei Chang, Hsu Cheng Deng, Da Chen Pang, Mu Yue Chen

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

18 Citations (Scopus)

Abstract

This paper presents the research results related to a new type of flexible capacitive micromachined ultrasonic transducers (cMUT) named "Sonic Paper". In this study, the novel design concept, relevant processing steps, and characterization experiments associated with the Sonic Paper were introduced. Compared with the existing curved or flexible CMUT, the Sonic paper features in simpler fabrication steps, lower processing temperature (less than 120°C ) and higher flexibility. Fabricated from polymer-based materials and inherited the natural flexibility from these materials, the Sonic Paper may facilitate the development and implementation of numerous innovative curvature-conforming applications in the future.

Original language	English
Title of host publication	2007 IEEE Ultrasonics Symposium Proceedings, IUS
Pages	527-530
Number of pages	4
DOIs	https://doi.org/10.1109/ULTSYM.2007.139
Publication status	Published (in print/issue) - 1 Dec 2007
Event	2007 IEEE Ultrasonics Symposium, IUS - New York, NY, United States Duration: 28 Oct 2007 → 31 Oct 2007

Conference

Conference	2007 IEEE Ultrasonics Symposium, IUS
Country/Territory	United States
City	New York, NY
Period	28/10/07 → 31/10/07

Keywords

cMUT
Flexible
Polymer technology

Access to Document

10.1109/ULTSYM.2007.139

Cite this

@inproceedings{971a127c91cb4c90bddf449335fb2392,

title = "A novel method for fabricating sonic paper",

abstract = "This paper presents the research results related to a new type of flexible capacitive micromachined ultrasonic transducers (cMUT) named {"}Sonic Paper{"}. In this study, the novel design concept, relevant processing steps, and characterization experiments associated with the Sonic Paper were introduced. Compared with the existing curved or flexible CMUT, the Sonic paper features in simpler fabrication steps, lower processing temperature (less than 120°C ) and higher flexibility. Fabricated from polymer-based materials and inherited the natural flexibility from these materials, the Sonic Paper may facilitate the development and implementation of numerous innovative curvature-conforming applications in the future.",

keywords = "cMUT, Flexible, Polymer technology",

author = "Chang, {Ming Wei} and Deng, {Hsu Cheng} and Pang, {Da Chen} and Chen, {Mu Yue}",

year = "2007",

month = dec,

day = "1",

doi = "10.1109/ULTSYM.2007.139",

language = "English",

isbn = "1424413834",

pages = "527--530",

booktitle = "2007 IEEE Ultrasonics Symposium Proceedings, IUS",

note = "2007 IEEE Ultrasonics Symposium, IUS ; Conference date: 28-10-2007 Through 31-10-2007",

}

TY - GEN

T1 - A novel method for fabricating sonic paper

AU - Chang, Ming Wei

AU - Deng, Hsu Cheng

AU - Pang, Da Chen

AU - Chen, Mu Yue

PY - 2007/12/1

Y1 - 2007/12/1

N2 - This paper presents the research results related to a new type of flexible capacitive micromachined ultrasonic transducers (cMUT) named "Sonic Paper". In this study, the novel design concept, relevant processing steps, and characterization experiments associated with the Sonic Paper were introduced. Compared with the existing curved or flexible CMUT, the Sonic paper features in simpler fabrication steps, lower processing temperature (less than 120°C ) and higher flexibility. Fabricated from polymer-based materials and inherited the natural flexibility from these materials, the Sonic Paper may facilitate the development and implementation of numerous innovative curvature-conforming applications in the future.

AB - This paper presents the research results related to a new type of flexible capacitive micromachined ultrasonic transducers (cMUT) named "Sonic Paper". In this study, the novel design concept, relevant processing steps, and characterization experiments associated with the Sonic Paper were introduced. Compared with the existing curved or flexible CMUT, the Sonic paper features in simpler fabrication steps, lower processing temperature (less than 120°C ) and higher flexibility. Fabricated from polymer-based materials and inherited the natural flexibility from these materials, the Sonic Paper may facilitate the development and implementation of numerous innovative curvature-conforming applications in the future.

KW - cMUT

KW - Flexible

KW - Polymer technology

UR - http://www.scopus.com/inward/record.url?scp=48149110315&partnerID=8YFLogxK

U2 - 10.1109/ULTSYM.2007.139

DO - 10.1109/ULTSYM.2007.139

M3 - Conference contribution

AN - SCOPUS:48149110315

SN - 1424413834

SN - 9781424413836

SP - 527

EP - 530

BT - 2007 IEEE Ultrasonics Symposium Proceedings, IUS

T2 - 2007 IEEE Ultrasonics Symposium, IUS

Y2 - 28 October 2007 through 31 October 2007

ER -

A novel method for fabricating sonic paper

Abstract

Conference

Keywords

Access to Document

Other files and links

Fingerprint

Cite this